Our company provides Wafer packaging materials for FAB and test factories, focusing on wafer packaging boxes, isolation paper (100% DuPont base paper), isolation pad (isolation sponge), etc. The isolation paper is packed by dust-free cutting. DuPont Wafer dust-free isolation paper provided by our company has surface resistance of more than 109 ohms, all of which are packaged in dust-free packaging and passed ROHS test.

    Dupont wafer isolation paper and Dupont Weiqiang provided by our company are made of high density polyethylene filament by special process. All raw materials used in dust-free field have been treated by de-electrostatic and anti-electrostatic layers, which can be applied to the environment with higher dust-free grade, and the material itself will not cause secondary pollution after purification. DuPont TYVEK is the only wafer packaging material that does not add reading errors.

    In addition, we also provide polyamide isolation paper.